Know the process of Electronic Assemblies or products:
The assembly and packaging of electronic products sector is constantly adapting to the requirements of the next generation of microelectronic systems. Devices of smaller size, the use of solders without lead and fluxes that do not require cleaning are some of the changes that have taken place in the processes of soft soldering by re-flow, soft solder by wave and selective welding. Regardless of the technology used, the key factor in the packaging of integrated circuits and the assembly of printed circuit boards are the process improvements that help to reduce defects, increase the up-time of processes and improve overall the cost of ownership.
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